DANAM
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Vacuum etching machine
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Vacuum etching machine

Core FeaturesMachine performanceApplicable processesCustomer installation siteMain components

Core Features

Vacuum etching
Precision spraying
Two-fluid nozzle
High-efficiency stripping filtration

Machine performance

Applicable plate width
250mm、500mm、25″、28.7″、49″
Etching line width function
50um/25um
Etching uniformity
Range value ≥95%
FPC
HDI
•
0.024mm~0.2mm(RTR), 0.036mm~1.6mm(STS)
•
0.036mm~2.4mm (inner layer), 0.4mm~3.2mm (outer layer)
Stability
Effectively combined with the control unit and air blower
Stabilize the ratio of drugs.

Applicable processes

1.
Etching process for outer layers of multilayer/HDI boards and etching process for class carrier boards
2.
DPC ceramic etching

Customer installation site

Main components

Equipment Part #1
Equipment Part #2
Equipment Part #3
Equipment Part #4
Equipment Part #5
Equipment Part #6
Equipment Part #7
Equipment Part #8
Equipment Part #9
Equipment Part #10
Equipment Part #11
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